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polyurethane flame-retardant structure adhesive
PSA-040
○ The bonding strength of aluminium materials is ≥9 MPa, and that of PET blue film is ≥2 MPa
○ It is easy to dispense and suitable for automated operations
○ Low density, resistant to high temperature and humidity, and impact-resistant
○ Flame retardant up to UL94 V-0, extinguishes immediately when removed from the fire source
Typical applications
It is widely used for heat conduction, insulation and sealing bonding in light and strong structural systems,
especially for new energy Integrated fixation of power batteries. It is also applicable to the construction industry
and can replace traditional connection methods This method enables the bonding and combination of materials
such as aluminum composite panels and PET plastics.
polyurethane thermal conductive structure adhesive
PSA-120 \ PSA-200 \ PSA-250
○ The bonding strength of aluminum materials is ≥7 MPa, and that of PET blue film is ≥2 MPa
○ Low density, resistant to high temperature and humidity, and impact-resistant
○ Low-hardness fillers are adopted to reduce wear on the mixing equipment
○ Flame retardant up to UL94 V-0, extinguishes immediately when removed from the fire source
Typical applications
It is widely used for heat conduction, insulation and sealing bonding in light and strong structural systems,
especially for new energy Integrated fixation of power batteries. It is also applicable to the construction industry
and can replace traditional connection methods This method enables the bonding and combination of materials
such as aluminum composite panels and PET plastics.
UV Encapsulation Adhesive TAS-3220
○ Insulating, moisture-proof, corrosion-resistant, and highly stress-buffering
○ Active thermal conductivity or flame retardancy
Typical Applications:
Filling and Sealing PIN pins in flexible circuit boards , and encapsulation of certain components
UV adhesive fixation adhesive TAS-3105
○High bonding strength, fast curing speed, good durability, wide range of applicable substrates
Typical application:
Moisture-proof, insulation and protective packaging of precision electronic instruments and components
UV+Moisture-Curing Adhesiv TAS-3001
○ Second-level rapid curing, high transparency
○ Controllable curing, low shrinkage rate
○After being boiled in water for 12 hours, the paint film remained intact, the adhesion remained unchanged, and the insulation performance remained the same.
Typical Applications:
Bonding and securing wire harness and certain components
electronic instruments and components
Self-healing sealant MS-TY1730
○ High-temperature resistance, electrical insulation, waterproof, moisture-proof, corrosion resistance
○ Non-curing, removable, easy to repair and replace
Typical Applications:
PACK enclosure sealing, non-planar sealing Crack sealing, insulating fillers
Thermal Conductive MS Sealant MS-1220H\TMS-1280
○ Environmentally friendly, low volatility, with minimal silicone oil migration
○ High-strength bonding with excellent adhesion and tensile strength
Typical Applications:
Bonding thermistors to heat sources
Other bonding scenarios requiring thermal conductivity
Single-component silicone sealant TMS-1215WH
○ Fast surface drying, its paste-like consistency prevents running for easy application
○ Excellent thermal conductivity for effective heat transfer
Typical Applications:
New Energy Vehicle Batteries (BMS)
Charging stations, Power controllers
Single-component methanol-releasing silicone bonding sealant TMS-1101
○ Excellent insulation and adhesion
○ Moisture-proof, Shock-resistant, Corona-resistant,
and Anti-electrical leakage
Typical Applications:
Bonding and filling sealing for power supplies
Fixing and insulation sealing of electronic components
Two-component flexible potting epoxy adhesive TET-1110
○ Can be cured at room temperature or by heating
○ Two-component formulation with excellent flowability
○ Superior crack resistance and cushioning protection
○ No cracking after 500 hours at 80°C
Typical Applications:
Battery module potting, high-voltage power supply potting,
transformer potting
wo-Component Epoxy Structural Adhesive TET-1001T\TET1250\TET1215H \ TET1220H
○ A room-temperature-curing epoxy resin with a 1:1 mix ratio by volume
○ Two-component system with low glass transition temperature
○ Can be heated for disassembly
○ Corrosion-resistant, rust-proof, waterproof
Typical Applications:
Automotive electronic control units, Memory and Power modules,
Enclosure bolting, Vision control systems, Consumer electronics mounting
The GMG series of thermal grease has excellent thermal conductivity, which can create an efficient thermal conduction channel between the heating element and the heat sink to effectively enhance the heat dissipation effect. The series has the characteristics of dustproof, anti-corrosion, shockproof and other characteristics to provide heat dissipation and protection for electronic components. It can ensure stable electrical performance of electronic components such as power amplifiers, electronic tubes, CPUs, etc., and improve the performance of electronic instruments and meters.
SGT is a kind of self-adhesive silicone thermal-conductive pouring sealant specially developed according to the heat dissipation needs of industrial parts, which is an ideal choice for thermal sealing in harsh environments.
PGT series thermal-conductive silicone padsowns excellent conformability, high thermal conductivity, self-adhesiveness, excellent insulation, and can be used to fill the surface gaps of irregular parts under low pressure conditions to achieve insulation, heat transfer, shock absorption and other functions. The series can meet the design requirements of equipment miniaturization and ultra-thinness, and has a wide range of thickness applications. It is an excellent thermally conductive filler material, which is widely used in electronic and electrical products.
PGN series thermal-conductive silicone gel is a kind of two-component flexible silica gel with low stress and high thermal conductivity. The product is generally used to fill the gap of heating components, eliminate the assembly tolerance of the device after curing, and effectively reduce the stress damage to the components due to it is vulcanized after automatic dispensing assembly. The cured thermal gel has similar properties to the thermal pad, with excellent high temperature resistance and aging resistance, and can work at -40~200°C for a long time.
Good initial tack and adhesion
High strength and good flexibility
Excellent wettability to the adhesive surface
Good initial tack and adhesion
High strength and good flexibility
Excellent wettability to the adhesive surface
Good initial tack and adhesion
High strength and good flexibility
Excellent wettability to the adhesive surface
Good initial tack and adhesion
High strength and good flexibility
Excellent wettability to the adhesive surface
