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 Home > Products > Thermally Conductive Silicone > TSP Thermal Pads
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TSP Thermal Pads

PGT series thermal-conductive silicone padsowns excellent conformability, high thermal conductivity, self-adhesiveness, excellent insulation, and can be used to fill the surface gaps of irregular parts under low pressure conditions to achieve insulation, heat transfer, shock absorption and other functions. The series can meet the design requirements of equipment miniaturization and ultra-thinness, and has a wide range of thickness applications. It is an excellent thermally conductive filler material, which is widely used in electronic and electrical products.


Product Advantages

  • william威廉中文官网
    Environmentally friendly and eco-friendly
  • william威廉中文官网
    UL94 V-0 rated for flame retardancy
  • william威廉中文官网
    Good temperature resistance
  • william威廉中文官网
    High deformation
  • william威廉中文官网
    Smooth and sticky surface
  • william威廉中文官网
    Excellent insulation
  • william威廉中文官网
    High compression resilience, soft and conformable
  • william威廉中文官网
    Good thermal conductivity and low thermal impedance

Performance Parameters

Physical property

Testing standardsPGT-350
ColorVisualizationGray, light blue
Thickness(mm)
Tolerance(%)
ASTM D374/D374M
/
0.5~10.00
±10
Density (g/cm3ASTM D7923.0±0.2
Hardness(Shore 00)ASTM D224055±5
Thermal Conductivity(W/(m·K))ASTM D54703.5±0.3
Electrical Strength ROHS(kV/mm)ASTM D149≥6.5
Volume resistivity (Ω·cm)ASTM D257>1010
Flame-retardant RatingUL 94V-0
Recommended operating temperature(℃)SAE J-2236-40~200
RoHS Compliant/YES

The above data is the average value of the overall test. Please contact our company for more technical information.

Application Scenarios

Technical Data

  • TDS
  • MSDS
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